Exceptional Rapid Delivery Capability: Flexible solutions for R&D prototyping, small-to-medium batches, and large-scale PCB design and manufacturing. Two-layer express orders completed within 24 hours; multi-layer express orders delivered in 2-4 days. Scale advantage for prototypes and small batches: Monthly production capacity exceeds 19,000 variants. World-class equipment capabilities: Capable of producing high-layer backplanes, HDI boards, semiconductor test boards, high-frequency boards, high-TG boards, halogen-free boards, rigid-flex boards, metal-core substrates, and other advanced technology products.   Conventional Rigid Board Process Capabilities Layers: 50 Board Thickness: 0.2mm–8.0mm Final Size: 22.5″ × 49″ Minimum Line Width/Spacing: 3.0mil Maximum Board Thickness-to-Hole Ratio: 40:1 Minimum Mechanical Drill Hole Size: 4mil Hole-to-Conductor Clearance: 3.5mil Impedance Tolerance (Ω): ±3 (<30) / ±10% (≥30) Surface Finish Processes: Leaded HASL, ENIG, ENEPIG, Immersion Tin, Immersion Silver, Full Board Gold Plating, OSP, Lead-Free HASL, Hard Gold Plating, Soft Gold Plating, Gold Fingers, etc. Materials: FR-4, High-TG, Halogen-Free, High-Frequency (Rogers, Arlon/Taconic, Nelco, Taixing Microwave F4B, Isola, etc.)   Rigid-Flex Board Process Capabilities Capable of mass-producing high-density rigid-flex board products. Layers/Flexible Layers: 36/10 Minimum Line Width/Spacing: 3.0/3.0mil Board Thickness-to-Hole Ratio: 20:1 Hole-to-Conductor Clearance: 6mil Impedance Tolerance (Ω): 10% Surface Finish Processes: Leaded HASL, ENIG, Immersion Tin, Immersion Silver, OSP, Lead-Free HASL, Hard Gold Plating, Soft Gold Plating, Silver Paste, etc. Impedance Control Technology HDI Technology   HDI 3+C+3: Standard Production 4+C+4: Low-Volume + Standard Production Laser Blind Via Electroplated Filling: Standard Production Minimum Laser Drill Hole Size (mil): 4   Metal-Core Substrate Process Capabilities Layers: 1–12L (Metal-Core & Metal-Clad Boards), 2–24L (Embedded/Metal-Inlaid Boards & Cold Plates & Thick-Copper Boards), 1–2L (Ceramic DBC Boards) Board Thickness: 0.5–7.0mm; Size: Max: 610×610, Min: 5×5mm Machining: X/Y/Z Precision ±0.03mm, Horn Holes, Screw Holes Thermal Conductivity Materials: Standard: 1–4W/m·k; Custom: 5–12W/m·k; Ceramic: 24–170W/m·k Maximum Routing Copper Thickness: 28OZ Metal Surface Finishes: Aluminum Anodizing (Standard/Hard), Aluminum Chemical Passivation, Sandblasting, Brushing, Surface Plating Surface Finish Processes: HASL, ENIG, ENEPIG, Immersion Tin, Immersion Silver, Full Board Gold Plating, Soft/Hard Gold Plating, OSP, etc. Types: Pre-Bonding, Post-Bonding, Sintering Processes, Metal-Clad Cores, Embedded Metal Blocks, Cold Plates, Ceramic DBC Boards